Board Design

High speed boards require an experienced design vendor aware of signal integrity issues at gigahertz speeds.

Comit provides schematic capture, design and signal integrity analysis of multi-layered high speed analog digital mixed signal boards with 4 mil trace widths and sub 5 mil separations.

   622 MHz multilayer
   analog/digital hot-swap
   boards

   4 mil trace widths
   Sub 5 mil separation

   LVDS. LVPECL
   Fiber-optic xponders

   Large device support
   eg. BGA 500

   Signal Integrity and high
   speed signal management

   Managed layout &
   prototype services

SEE SAMPLE DESIGNS

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BOARD DESIGN FLOW AND TOOLS

RISK MANAGEMENT

Design examples include hot-swappable 18-layer 4-mil PCB with 622-MHz clocks, LVDS, LVPECL, fiber-optic transponders, -48V supplies, DC/DC, PowerPC CPU, Xilinx, Altera & Triscend FPGAs, SONET Framers, TL1 command language support, OC-3/OC-12 Network Processor-based PCI-bus ATM/POS Network Interface Cards, 480 MHz Ultra-Sparc Hot-Swap Compact-PCI PCB, etc.

Managed auxiliary services include layout, component procurement, fab, assembly and testing. Comit engineers can work with you to determine high speed signal management strategies and material selection issues for high-speed multilayer stackups.

Combined with Comit's chip design and embedded software development capabilities, you have the ability to finally implement a one-stop contracting strategy that minimizes third party interactions and enables faster turnarounds for your products.